Aralin 1Pagpili ng Parameter at Settings: continuous vs pulsed mode, suggested power ranges para sa excision, duty cycle, tip activation at calibrationTinutakpan ng seksyong ito ang pagpili ng diode laser parameter, na naghahambing ng continuous at pulsed modes, tinutukoy ang mga ligtas na power ranges, duty cycle implications, at practical methods para sa tip activation, calibration, at test firing upang makamit ang efficient cutting na may minimal thermal damage.
Continuous versus pulsed mode indicationsRecommended power ranges para sa excisionDuty cycle effects sa tissue interactionFiber tip initiation at maintenanceCalibration, test firing, at safety checksAralin 2Paghahambing sa scalpel excision: bleeding control, operative time, postop pain, healing quality, at histologic artifact implicationsInihahalintulad ng seksyong ito ang diode laser excision sa scalpel surgery, na tumutugon sa intraoperative bleeding, operative time, postoperative pain, healing quality, at potential histologic artifacts na maaaring makaapekto sa diagnostic accuracy at reporting.
Bleeding control at field visibilityOperative time at efficiencyPostoperative pain at analgesic needsHealing patterns at scar formationHistologic artifact at margin assessmentAralin 3Risks, komplikasyon at mitigation: delayed healing, thermal necrosis, scarring, nerve damage at kanilang pagpigilSinusuri ng seksyong ito ang risks at komplikasyon ng diode soft tissue surgery, tulad ng delayed healing, thermal necrosis, scarring, nerve injury, at infection, at nagpapakita ng preventive strategies, early recognition signs, at evidence-based management protocols.
Mechanisms ng thermal tissue damageRecognizing delayed healing patternsPreventing at managing scarringAvoiding at managing nerve injuryInfection control at wound careAralin 4Paghawak ng Specimen at kailan ipadala para sa histopathology pagkatapos ng laser excisionIpinaliliwanag ng seksyong ito kung paano pamahalaan ang tissue specimens pagkatapos ng diode excision, kabilang ang handling upang mabawasan ang thermal artifact, fixation protocols, labeling, completion ng pathology forms, at criteria para laging ipadala ang samples para sa histopathologic evaluation.
Kailan mag-submit ng tissue para sa histologyMinimizing laser-induced artifactFixation, containers, at labelingCompleting pathology request formsCommunicating findings sa patientsAralin 5Rationale sa pagpili ng Laser: bakit diode (810–980 nm) para sa soft tissue excision — absorption by hemoglobin at melanin, hemostasis benefitsIpinaliliwanag ng seksyong ito kung bakit pinipili ang diode lasers sa 810–980 nm range para sa maraming soft tissue procedures, na binibigyang-diin ang absorption sa hemoglobin at melanin, hemostasis, reduced bleeding, at practical selection sa mga available diode units.
Optical absorption sa hemoglobin at melaninHemostatic advantages over scalpelClinical indications favoring diode useSelecting wavelength at fiber sizeLimitations compared with other lasersAralin 6Patient assessment: medical history, medications (anticoagulants, photosensitizers), lesion evaluation at differential diagnosisItinutukoy ng seksyong ito ang comprehensive preoperative assessment, kabilang ang medical history, medication review para sa anticoagulants at photosensitizers, lesion description, differential diagnosis, at documentation upang bigyang-katwiran ang diode laser use o referral.
Targeted medical at dental historyReviewing anticoagulants at photosensitizersExtraoral at intraoral lesion mappingFormulating a differential diagnosisCriteria para sa referral before surgeryAralin 7Preoperative preparation at informed consent specifics para sa laser soft tissue proceduresNakatuon ang seksyong ito sa preoperative preparation, kabilang ang patient education, specific informed consent elements para sa laser use, pre-op photographs, antisepsis, at verification ng laser safety measures at emergency readiness sa operatory.
Explaining laser benefits at limitationsDocumenting laser-specific consent itemsPreoperative photography at chartingOral rinses at field antisepsisVerifying laser safety at eyewearAralin 8Indications at case selection: benign mucosal lesions na angkop para sa diode excision at contra-indicated lesions na nangangailangan ng biopsy o referralGumagabay ang seksyong ito sa case selection para sa diode excision, na itinutukoy ang benign mucosal lesions na angkop para sa laser removal, clinical red flags na nangangailangan ng biopsy o referral, at documentation na sumusuporta sa safe, defensible treatment decisions.
Benign lesions suitable para sa diode excisionLesion features requiring urgent referralWhen incisional biopsy is preferredPhotographic at chart documentationCommunicating options at limitationsAralin 9Immediate postoperative management: wound care, analgesia, topical agents, follow-up scheduleIpinaliliwanag ng seksyong ito ang structured postoperative care pagkatapos ng diode laser surgery, kabilang ang wound hygiene, analgesic regimens, topical agents, dietary advice, at evidence-based follow-up intervals upang suportahan ang uneventful healing at patient comfort.
Postoperative wound hygiene instructionsSystemic at local analgesia protocolsUse of topical gels, rinses, at dressingsDiet, activity, at oral habit restrictionsFollow-up visit timing at documentationAralin 10Anesthesia planning: local anesthetic choices at techniques, epinephrine considerations, managing patients sa anticoagulantsTinatanghal ng seksyong ito ang anesthesia planning para sa diode soft tissue surgery, kabilang ang choice ng local anesthetic, epinephrine use para sa hemostasis, injection techniques, at risk assessment at modification para sa patients na kumukuha ng anticoagulants o antiplatelet medications.
Selecting local anesthetic agentsEpinephrine benefits at contraindicationsInfiltration at nerve block techniquesAssessing anticoagulant at antiplatelet riskCoordinating with physicians when neededAralin 11Step-by-step operative technique: tissue marking, incision/excision technique gamit ang contact fiber, lateral sweeping, depth control, hemostatic strategiesItinatanghal ng seksyong ito ang stepwise diode excision protocol, na sumasaklaw sa lesion marking, fiber orientation, incision at lateral sweeping techniques, depth at margin control, hemostatic maneuvers, at intraoperative adjustments upang mapanatili ang safety at precision.
Preoperative marking at isolationFiber angulation at contact techniqueIncision patterns at sweeping motionDepth control at margin managementIntraoperative hemostatic strategies
