Lesson 1Basic block diagram components and interconnections: power, MCU, sensor, alarm outputs, and optional communications (UART/CAN/Ethernet)This section builds complete block diagrams for embedded nodes, covering power, MCU, sensors, outputs, and communication links. You will learn how signals and supplies interconnect and how to document assumptions and interfaces clearly.
Power tree and voltage rail definitionMCU, clock, and reset block groupingSensor interfaces and signal conditioningAlarm outputs and user indication pathsOptional UART, CAN, and Ethernet linksLesson 2Microcontroller selection criteria: required peripherals (I²C/SPI/UART/CAN, ADC, timers), flash/RAM, hardware watchdogs, brown-out detection, and packagingThis section details microcontroller selection criteria, including peripherals, memory, watchdogs, brown-out detection, and packaging. You will learn to translate firmware and system needs into concrete MCU part numbers.
Peripheral set: I²C, SPI, UART, CAN, ADCFlash, RAM, and nonvolatile storage sizingWatchdogs, brown-out, and safety featuresClock sources, timers, and low-power modesPackage choice, pinout, and manufacturabilityLesson 3Digital temperature sensors: I²C vs SPI sensors, accuracy-class examples, max operating temperature, and how to read datasheets for timing and error budgetsThis section compares I²C and SPI digital temperature sensors, focusing on accuracy classes, operating limits, and timing. You will practice reading datasheets to build error budgets and choose parts that match system performance goals.
I²C vs SPI temperature sensor interfacesAccuracy classes and total error budgetMaximum operating temperature and deratingTiming diagrams and bus transaction limitsNoise, filtering, and conversion time tradeoffsLesson 4PCB layout and grounding best practices for industrial environments: routing, star grounds, filter placement, and connector selectionThis section explains PCB layout and grounding strategies for noisy industrial sites. You will learn routing priorities, star and split grounds, filter placement, and connector choices that improve EMC, robustness, and serviceability.
Layer stackup and return path planningStar, split, and solid ground strategiesPlacement of filters and protection partsRouting for low-noise analog and fast digitalConnector selection and pinout strategiesLesson 5Power supply design for embedded modules: regulators, sequencing, filtering, and protection (TVS, fuses, reverse polarity)This section covers power supply design for embedded modules, including regulator selection, sequencing, filtering, and protection. You will learn to design robust rails that tolerate surges, reverse polarity, and industrial noise sources.
Selecting linear versus switching regulatorsPower rail sequencing and startup behaviourInput filtering and bulk capacitance sizingTVS diodes, fuses, and reverse polarityEfficiency, thermal limits, and deratingLesson 6Design-for-reliability in hardware: decoupling and bulk capacitors, ground planes, EMI suppression, isolation options, and thermal managementThis section focuses on hardware design-for-reliability, including decoupling, ground planes, EMI suppression, isolation, and thermal design. You will learn to anticipate stress conditions and design margins for long field lifetimes.
Decoupling and bulk capacitor strategiesGround planes and current return controlEMI filters, ferrites, and snubber networksIsolation options and creepage distancesThermal paths, heatsinks, and deratingLesson 7Analog sensor alternatives and front-end considerations: thermocouples and RTDs with ADCs or amplifiers (when digital sensor limits exceeded)This section explores analog temperature sensing when digital sensors are insufficient. You will compare thermocouples and RTDs, front-end amplifiers, ADC choices, and layout practices that preserve accuracy in harsh conditions.
Thermocouple types and cold-junction needsRTD characteristics and wiring configurationsInstrumentation amplifiers and gain settingADC resolution, sampling, and reference designShielding, grounding, and sensor cablingLesson 8Output driver selection: relays, solid-state relays, MOSFET drivers, buzzer and LED drivers; derating and isolation for safetyThis section covers output driver options such as relays, solid-state relays, MOSFET stages, and indicator drivers. You will learn to size components, apply derating, and design isolation to meet safety and reliability standards.
Electromechanical relay pros and consSolid-state relays and triac driversLow-side and high-side MOSFET driversBuzzer and LED driver implementationIsolation, creepage, and safety deratingLesson 9Common 32-bit MCU families: overview and comparison (STM32, NXP LPC/Kinetis, Microchip SAM/PIC32) and how to map requirements to family featuresThis section surveys major 32-bit MCU families and their ecosystems, then shows how to map application requirements to concrete device choices. You will compare peripherals, memory, tools, and long-term availability constraints.
STM32 families and ecosystem overviewNXP LPC and Kinetis family characteristicsMicrochip SAM and PIC32 family overviewComparing peripherals, memory, and performanceMapping system requirements to MCU families
